Method and apparatus for manufacturing electronic parts

ABSTRACT

The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. 
     The first cutting device  23  cuts the wiring boards  3  into separate parts along one direction, so that the cut wiring boards  3  constitute strip-form cut wiring boards  3   a . The cut wiring boards  3   a  are conveyed to the second cutting device  33 , and are fed [into the second cutting device  33 ] by the second conveying device  43  along the direction of length. [The cut wiring boards  3   a ] are then cut by the second cutting device  33  with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards  3   b  resulting from the cutting performed by the second cutting device  33  constitute the original forms of the IC packages. The wiring boards  3   b  that have been cut and conveyed from the second cutting device  33  enter a cleaning step.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method and apparatus formanufacturing electronic parts. More particularly, the present inventionrelates to a method and apparatus for manufacturing electronic parts inwhich wiring boards on which a plurality of IC chips are mounted andwhich are packaged by means of a synthetic resin are cut in order to cutthese boards into individual IC packages.

2. Description of the Related Art

As semiconductors have become more highly integrated, packages in whichthe leads are disposed on the undersurface of the package as in a BGA(ball grid array) or the like have begun to be used. The manufacture ofindividual IC packages by the cutting of a wiring board on which ICchips sealed with a synthetic resin are mounted is known. Variousmethods have been proposed as methods for cutting IC chips packaged in asynthetic resin into individual IC packages. The separation of ICpackages on which IC chips are mounted by cutting using a diamond saw(which is a cutting grindstone using a diamond blade) or the like is oneexample of such a method.

Furthermore, prior to the dicing of semiconductor substrates, measuressuch as coating of the back surfaces of the semiconductor substrateswith a polyimide and bonding to a dicing tape or the like are performed.Moreover, cutting in a cross pattern using the same cutting device withthe orientation of the table on which the semiconductor substrates arecarried being varied is also known as a separation method. Furthermore,in such separation processes, tape bonding is performed prior tocutting, and cleaning using a cleaning liquid is performed followingcutting in order to remove adhering cutting debris.

However, conventional separation methods involve various problems, andit has not always been possible to increase the production efficiency.In regard to tape bonding, the following problem has been encountered:specifically, in cases where cutting is performed with the tape in abonded state, the grindstone may become clogged during cutting so thatoperation becomes impossible, thus resulting in defective products.

Furthermore, since cleaning following cutting is performed using washwater, there is a danger of the dissolution of heavy metals, so that aspecial waste water treatment must be performed in order to avoidenvironmental problems; as a result, the cost of the product isincreased. Since water is used for cleaning, this water invades finecracks and peeled areas in stacked parts, and remains in these areas. Asa result, there is a danger that these parts will become corroded, orthat current leakage will occur so that a defective product is produced.

The abovementioned cutting is performed by the same cutting device whileindexing the table on which the member that is being cut, such as awiring board or the like, is carried, and varying the direction so thatcutting is performed again in a different direction. Simultaneouscutting in two directions cannot be performed using a single workingapparatus. Furthermore, in the case of mass production, a line isconstructed, and the work is divided into a plurality of processes.However, this results in the use of lines that are used exclusively forspecified products that are being worked, so that such a method lacksflexibility; furthermore, such a process is expensive and requires alarge amount of space for the equipment.

Especially in cases where there is a change in the member that is beingcut, such as a wiring board or the like, expensive jigs and tools mustbe changed; furthermore, a degree of experience in the working processis also required, and time is required for such replacements. Also incases where the finished products are recovered and accommodated,conventional methods involve a process in which the solder ball parts,which consist of metallic solder and which are connected to printedcircuit boards, are caused to face the cutting tool during cutting. Inother words, cutting is ordinarily performed with the solder ball partsfacing upward. Accordingly, after cutting or when the products arerecovered, the products are again inverted and accommodated in a casewith the solder ball parts facing downward. Consequently, time is alsorequired for this accommodation of the products.

SUMMARY OF THE INVENTION

The present invention was devised on the basis of such a technicalbackground, and achieves the following objects.

One object of the present invention is to provide a method and apparatusfor manufacturing electronic parts which are devised so that differentwiring boards can be simultaneously cut by a plurality of cuttingdevices, thus improving the manufacturing efficiency in economic terms.

A further object of the present invention is to provide a method andapparatus for manufacturing electronic parts which are devised so thatdust generated in the cutting step is captured in order to protect theelectronic parts during cutting, thus improving the quality of theelectronic parts.

A further object of the present invention is to provide a method andapparatus for manufacturing electronic parts in which the positions ofthe conveyed wiring boards are accurately recognized so that cutting isperformed in accurate cutting positions, thus increasing the cuttingefficiency.

A further object of the present invention is to provide a method andapparatus for manufacturing electronic parts which are devised so thatthe electronic parts that have been cut are cleaned and inverted in theproduct accommodating step, thus allowing efficient productaccommodation in a short period of time.

The present invention adopts the following means in order to achieve theabovementioned objects.

The method of the present invention for manufacturing electronic partscomprises a conveying step wherein plate-form electronic parts sealed inresin are conveyed, a first fastening step wherein said conveyedplate-form electronic parts are positioned and fastened in place, afirst cutting step wherein said plate-form electronic parts that havebeen positioned and fastened in place in said first fastening step aremoved in one direction on the plane including said electronic parts, andare cut, a second fastening step wherein strip-form electronic partsthat have been cut in said first cutting step are conveyed, positionedand fastened in place, a second cutting step wherein the strip-formelectronic parts that have been conveyed, positioned and fastened inplace in said second fastening step are moved in a direction thatcrosses the abovementioned cutting direction, and are cut, and a productaccommodating step wherein single electronic parts that have been cut insaid second cutting step are accommodated.

Furthermore, said first fastening step and said second fastening stepmay include an optical recognition step wherein the positions of saidplate-form electronic parts or said strip-form electronic parts that areconveyed are optically recognized.

Furthermore, said first fastening step and said second fastening stepmay be press-fastening steps wherein said plate-form electronic parts orsaid strip-form electronic parts are fastened in place by theapplication of pressure from above after said electronic parts have beenplaced on a carrying table.

Furthermore, said first cutting step and second cutting step may besteps wherein cutting is performed by causing a rotary grindstone tomove.

Furthermore, said first cutting step and second cutting step may includea step wherein dust or the like generated by cutting is removed bysuction.

Furthermore, said product accommodating step may include a step whereinsaid single electronic parts cut in said second cutting step are clampedand inverted, and the orientation of said electronic parts is altered.

Furthermore, said product accommodating step may include a step whereinsaid clamped single electronic parts are brushed.

The apparatus of the present invention for manufacturing electronicparts comprises a conveying body which is used to convey the electronicparts, a first fastening device which positions and fastens plate-formelectronic parts sealed in resin that are conveyed by said conveyingbody, a first cutting device which moves said electronic parts that havebeen positioned and fastened in place by said first fastening device inone direction on the plane including said electronic parts, and cutssaid electronic parts, a second fastening device which conveys,positions and fastens strip-form electronic parts that have been cut bysaid first cutting device, a second cutting device which moves saidstrip-form electronic parts that have been conveyed, positioned andfastened in place by said second fastening device in a direction thatcrosses the abovementioned cutting direction, and which cuts saidelectronic parts, and a product accommodating device which accommodatesthe single electronic parts that have been cut by said second cuttingdevice.

Furthermore, the first fastening device and said second fastening devicemay contain a position recognition device which optically recognizes thepositions of said plate-form electronic parts or said strip-formelectronic parts that have been conveyed.

Furthermore, the device that optically recognizes the positions of saidplate-form electronic parts or said strip-form electronic parts may be adevice which recognizes the shapes of said electronic parts by means ofa CCD camera, and specifies the cutting positions.

Furthermore, the first fastening device and said second fastening devicemay be devices that fasten said conveyed plate-form electronic parts orsaid [conveyed] strip-form electronic parts by means of restrainingmembers that apply pressure from above after said electronic parts havebeen placed on a carrying table.

Furthermore, said first fastening device and said second fasteningdevice may be devices that have attached means fastening said plate-formelectronic parts or said strip-form electronic parts by means of avacuum suction force.

Furthermore, in said first fastening device and said second fasteningdevice, projecting parts which are used to press said plate-formelectronic parts or said strip-form electronic parts may be formed onsaid restraining member.

Furthermore, in the restraining members that fasten said plate-formelectronic parts or said strip-form electronic parts after saidelectronic parts have been placed on a carrying table, cutting grooveswhich are used to allow the passage of a rotary tool in order to cutsaid plate-form electronic parts or said strip-form electronic parts maybe formed in said carrying tables and restraining members.

Furthermore, said first cutting device and second cutting device may beequipped with dust collectors that use suction to capture the dust-formcutting debris that is generated by cutting.

Furthermore, said first cutting device and said second cutting devicemay be devices which have rotary cutting tools, and which performadvancing and retracting movements on two or more axes.

Furthermore, said rotary cutting tools may be tools that are formed ascomposite tools by the electrodeposition of diamond abrasive grains andCBN abrasive grains.

Furthermore, said product accommodating device may include a devicewhich clamps said single electronic parts cut by said second cuttingdevice, inverts said electronic parts and alters the orientation of saidelectronic parts.

Furthermore, said product accommodating device may include a devicewhich brushes the clamped single electronic parts.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view which shows the product manufactured by theapparatus of the present invention;

FIG. 2 shows the wiring board manufactured by the apparatus of thepresent invention; FIG. 2 (a) is a perspective view of the overallwiring board, FIG. 2 (b) is a partial enlarged view of FIG. 2 (a), andFIG. 2 (c) is a partial enlarged view of FIG. 2 (b);

FIG. 3 shows an overall view of the apparatus of the present invention;FIG. 3 (a) is a perspective view which shows the overall construction,and FIG. 3 (b) is an explanatory diagram which shows the respectivedevices contained in the apparatus in model form;

FIG. 4 is a skeleton diagram which shows the construction of theapparatus of the present invention;

FIG. 5 is a process diagram which shows the manufacturing process of theelectronic parts manufactured by the apparatus of the present invention;

FIG. 6 is a block diagram which shows the control part of the apparatusof the present invention;

FIG. 7 is a perspective view which shows the relationship between thecarrying table and restraining member of the first fastening device;

FIG. 8 is a perspective view which shows the relationship between thecarrying table and restraining member of the second fastening device;

FIG. 9 is a perspective view which shows the small hole parts in thecarrying table;

FIG. 10 is a perspective view which illustrates the first cuttingdevice;

FIG. 11 is a perspective view which shows the state of attachment of therotary tool to the head of the cutting device;

FIG. 12 is a perspective view which shows the second cutting device;

FIG. 13 is a perspective view which shows the state of attachment of thecover to the head of the cutting device;

FIG. 14 is a perspective view which shows the construction of fins forthe head of the cutting device;

FIG. 15 is a perspective view which shows the cleaning device;

FIG. 16 is a perspective view which shows the disposition of a pair ofbrushes facing each other, and the passage of the wiring board [betweensaid brushes];

FIG. 17 shows the clamping members; FIG. 17 (a) is a perspective viewwhich shows the construction that clamps the wiring board, and FIG. 17(b) is a perspective view which shows the inversion of the clampingmembers of the construction shown in FIG. 17 (a); and

FIG. 18 shows the rotary tool; FIG. 18 (a) is a perspective view of thetool overall, FIG. 18 (b) is a partial enlarged view of FIG. 18 (a), andFIG. 18 (c) is a partial enlarged view of FIG. 18 (b)

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[Embodiment 1]

Below, Embodiment 1 of the present invention will be described withreference to the attached figures. FIG. 1 shows an object IC chip whichis cut by the cutting devices of the present invention; this figureshows a part which has been formed into a product by final cutting. FIG.2 shows electronic parts before the parts have been cut; this figureshows a plate-form wiring board. FIG. 2 (a) shows the overall shape ofthe wiring board, FIG. 2 (b) shows a partial enlarged view of FIG. 2(b), and FIG. 2 (c) shows a partial enlarged view of FIG. 2 (b). Detailswill be described below.

The product 1 shows the external appearance of the final product that iscut by the cutting devices of the present invention. This is generallycalled an IC package, and an IC chip 2 is built into the interior ofthis package. The wiring board 3 shows the state prior to cutting, inwhich a plurality of the products 1 are built into the wiring boardprior to the separation of the products 1. The wiring board 3 is anaggregate on which a plurality of IC chips 2 are mounted; this is aboard which is used to mount the IC chips, and is used for theelectrical connection of electrical wires to solder balls 7 disposed onthe undersurface of the wiring board 3.

The entire upper surface of the wiring board 3 is covered by aprotective molding 8 made of a synthetic resin in order to protect theIC chips 2. Accordingly, the wiring board 3 referred to in the presentembodiment constitutes an aggregate of so-called IC packages. ICpackages are manufactured by being cut out of this wiring board 3 inunits of IC chips 2. In recent years, high integration of IC chips 2 insuch IC packages has progressed; as a result, there has been anaccelerated increase in the size of IC packages.

However, the technology of IC packages themselves has also beendeveloped with the aim of reducing the external size of the packages. Anexample of this is called a BGA (ball grid array), which is used inportable telephones and the like. In such a BGA, the size is reduced byachieving a narrow electrode pitch, i.e., a high electrode density, andleads are disposed on the undersurface of the IC package in the form ofan area array.

The method and apparatus of the present embodiment for manufacturingelectronic parts can be applied to the aforementioned BGA. This relatesto a manufacturing technique in which such IC packages are cut from awiring board 3, so that these packages are cut out as products 1 whichconstitute unit IC packages. Next, such IC packages will be described.The wiring board 3 is laminated by bonding together a plurality ofsheets (three sheets in the present example) of a thin film 6 consistingof a thermosetting synthetic resin such as an epoxy type resin or thelike.

Metal lead wires 10 consisting of copper or the like are wired so thatthese wires do not cross each other between the thin films 6;furthermore, wire connections are made so that the upper, middle andlower films, 6, 6 a and 6 b are stitched together. The IC chips 2 arebonded to the surface of this film 6 in a plurality of rows in the formof a lattice. Terminals of solder balls 7 which are connected to the ICchips 2 are disposed on the undersurfaces of the IC packages on whichthese IC chips are mounted.

These solder balls 7 have a hemispherical shape, and consist of a soldermetal which is known to allow easy mounting on printed circuit boardsand the like. Furthermore, the upper surfaces of the IC chips 2(including the bonding wires 9) are covered by a protective molding 8 inorder to protect the IC chips 2. This protective molding 8 is a thinsheet-form molding made of a thermosetting synthetic resin. The bondingwires 9, which are made of conductors, are connected from the IC chips2.

The wiring board 3 is an aggregate consisting of a plurality of ICpackages, and is formed with recesses between the IC packages. Thewiring board 3 has an external appearance resembling that of a chocolatebar, and is a single plate-form part formed by laminating the films 6, 6a and 6 b. Furthermore, first cutting position marks 4 and 5 which areused for recognition of the cutting positions by a recognition device(described later) are engraved or printed on this wiring board 3. Next,the apparatus of the present invention will be described in detail.

(Overall System of Manufacturing Apparatus)

FIG. 3 is an external view which shows the overall construction of theelectronic part manufacturing apparatus S of the present embodiment ofthe invention in model form. FIG. 3 (a) is an external view in which therespective devices are shown as boxes, and FIG. 3 (b) is a diagram whichshows the respective devices installed inside the apparatus in FIG. 3(a) in model form. FIG. 4 is an explanatory diagram which shows theoverall construction of this electronic part manufacturing apparatus inskeleton form. FIG. 5 is an explanatory diagram which shows themanufacturing steps up to the point where the wiring board 3 is cut sothat individual IC packages are formed.

In outline, the electronic part manufacturing apparatus S comprises aconveying part 11, a working part 12 and an accommodating part 13. Theconveying part 11 is used to convey the wiring boards 3. The workingpart 12 includes a recognition device which is used to recognize thecutting positions of the wiring boards 3 that are to be cut, twofastening devices which are used to position and fasten the wiringboards 3, two cutting devices which are used to cut the wiring boards 3,a dust collector device which is used to capture the dust that isgenerated by cutting, and a cleaning device for the cut IC packages. Theaccommodating part 13 is used to accommodate the finished products.

In FIG. 3, the wiring boards 3 are conveyed from the left side of FIG. 3(b) via the conveying part 11. The central part in FIG. 3 (b) is theworking part 12; this working parts 12 has two constructions, andcomprises a working part 12A which participates in the first cutting,and a working part 12B which participates in the second cutting.

A first CCD camera 20 and a second CCD camera 30, which are recognitiondevices whose positions and shapes will be described later, carryingtables 21 and 31 which carry the wiring boards, restraining members 22and 32, a first cutting device 23 and second cutting device 33, dustcollectors 24 and 34, and a rotary brush 25 or the like, are installedas respective devices involved in these cutting processes. Furthermore,a control device 14 which controls the operations of these respectivedevices is disposed on the upper part of the working part 12.

The accommodating part 13 which is disposed on the right side in termsof the orientation shown in FIG. 3 (b) is constructed from a productfeed-out device (see FIG. 4) 80 and a product accommodating box 81.Furthermore, dust collectors 24 and 34 which capture dust followingcutting are disposed beneath the working part 12.

Next, the overall construction will be described in detail withreference to FIGS. 4 and 5. A first conveying device 41 is installed onthe left end with respect to the orientation shown in FIGS. 4 and 5;this [conveying device 41] holds wiring boards 3 and conveys thesewiring boards 3 toward the right. The first CCD camera 20, which is arecognition device, is installed near the conveying end, and is arrangedso that this CCD camera 20 recognizes first cutting position marks 4that are engraved in the wiring boards 3.

The first cutting device 23 is a device which is used to cut the wiringboards 3 into separate parts in one direction. The cut wiring boards 3are thus formed into rectangular-form cut wiring boards 3 a (see FIG.5). Following cutting, these rectangular-form cut wiring boards 3 a areshifted, and are conveyed to the second cutting device 33 by the secondconveying device 42. In this case, the second cutting position marks 5are recognized by the second CCD camera 30, which constitutes a secondrecognition device. The orientation of the second cutting device 33 isaltered by 90 degrees relative to the orientation of the first cuttingdevice 23, and this second cutting device 33 is disposed in the vicinityof the first cutting device 23 so that said second cutting device 33 cancut the cut wiring boards 3 a.

The rectangular-form cut wiring boards 3 a are transferred to the secondcutting device 33 two boards at a time from the first cutting device 23without any change in orientation by the first conveying device 41 andsecond conveying device 43. As is shown by the arrows in FIGS. 4 and 5,the second conveying device 42 moves vertically in the shiftingdirection and conveys the rectangular-form cut wiring boards 3 a. Thetransferred cut wiring boards 3 a have the form of long, slender strips,and are fed in by the second conveying device 43 along the direction oflength. After the second cutting position marks 5 are recognized by thesecond CCD camera 30 at an intermediate point, and the rectangular-formcut wiring boards 3 a are fastened in place, these rectangular-form cutwiring boards 3 a are cut by the second cutting device 33 with thecutting direction altered by 90 degrees relative to the first cuttingdirection.

The wiring boards 3 b,the single wiring boards 3 b resulting from thiscutting by the second cutting device 33 are the original forms of the ICpackages. The wiring boards 3 b that have been cut and conveyed from thesecond cutting device 33 enter a cleaning step, and are brushed by arotary brush 25. When brushing is completed in the process of thiscleaning, the wiring boards 3 b are inverted and accommodated in theproduct accommodating part 81 as IC package products. In the presentinvention, a series of systematic operations is thus fully automated,and performed using a single apparatus.

[Control Device 14]

FIG. 6 is a block diagram which illustrates the system control of thecutting steps of the manufacturing apparatus S of the present invention.The control device 14 performs operational processing with respect tothe three processes of the conveying part 11, working part 12 andaccommodating part 13, so that the cutting of the wiring boards 3 isperformed organically. The central processing unit 101 is a control partthat forms the basis of the operating part. The ROM 102 is a memory partin which the basic programs of the cutting steps of the manufacturingapparatus S of the present invention are stored.

The RAM 103 is a memory part in which data and the like are stored; ifthe set conditions change, this data can be rewritten from an operatingpanel or the like. The display part 104 is the screen of a CRT or thelike; this display part displays the contents of programs and data. Thecontrol parts of the individual devices are organically connected [tothis display part], and the actuators of the respective devices areoperated [using said display part].

The control part 105 is a control part which is used to control theconveying operation of the conveying part, the control part 106 is acontrol part which is used to control the working operation of theworking part, and the control part 107 is a control part which is usedto control the accommodating operation of the accommodating part.Furthermore, the other control part 108 is a control part which is usedto control the operation of (for example) other conveying bodies and thelike. The outline construction of the control system of themanufacturing apparatus of the present invention is as described above.

For example, in cases where the speeds of the conveying devices, rotarytools or the like are altered, or in cases where the set positions arealtered, such alterations can be made while viewing the screen of theabovementioned display device 104. Next, the individual devices will bedescribed in detail.

[Conveying Part 11]

The wiring boards 3 that are inserted from the outside of the apparatusare positioned in specified positions and conveyed by the loader 41 a ofthe first conveying device 41 with the surface on which the solder balls7 are disposed facing upward. This first conveying device 41 also actsas an accommodating compartment, and accommodates a plurality of wiringboards 3. At the time of cutting, the wiring boards 3 are conveyed oneat a time toward the cutting devices by the loader 41 a. The loader 41performs a two-dimensional operation in the vertical direction and theconveying direction.

The position of this loader 41 is regulated and guided by a linear guide(not shown in the figures) installed on the base. This linear guide isan ordinary commercially marketed linear guide; accordingly, adescription of this linear guide is omitted here. Furthermore, whenwiring boards 3 are inserted, this loader 41 a moves in order to pushthe wiring boards 3 out.

[Working Part 12]

This working part 12 is constructed from a first CCD camera 20 and asecond CCD camera 30 which are used to position the conveyed wiringboards 3 on the carrying table 21, a first cutting device 23 and secondcutting device 33 for the fastened wiring boards 3, second conveyingdevices 42 and 43 which convey the wiring boards 3 from the firstcutting device 23 to the second cutting device 33, position the wiringboards 3 and fasten the wiring boards 3, dust collectors 24 and 34 whichcapture the dust generated by the first cutting device 23 and secondcutting device 33, a cleaning device 70 which cleans the product wiringboards 3 b cut by the second cutting device 33, and the like.

a. Carrying Tables 21 and 22

The carrying tables 21 and 22 will be described mainly with reference toFIGS. 7 and 9, with reference also being made to FIGS. 4 and 5. Theconveyed wiring boards 3 are placed on the carrying table 21. Thiscarrying table 21 has a shape that is long in the longitudinaldirection. A cutting groove 21 a is formed in the central part of thecarrying table 21, and this cutting groove 21 a passes entirely throughthe carrying table 21 from top to bottom. This cutting groove 21 a is agroove which is used to allow the passage of a rotary cutting grindstone63. A hose 24 a which is used to trap dust generated during cutting isconnected to the bottom of this cutting groove 21 a.

A dust collector 24 is disposed on the tip of this hose 24 a.Accordingly, dust-form cutting debris which is generated beneath thecarrying table 21 during cutting is sucked into the dust collector 24via the hose 24 a and recovered. Furthermore, around the cutting groove21 a of the carrying table 21, a plurality of small holes 21 b areformed along the groove so that these small holes pass through thecarrying table 21. These small holes 21 b are used to hold the wiringboard 3 on the carrying table 21 by means of suction; the wiring board 3is held on the carrying table 21 by the suction force of the dustcollector 24 via these small holes 21 b.

In this case, since the dust generated during cutting is simultaneouslysucked in, the suction force that holds the wiring board 3 on thecarrying table 21 via the small holes 21 b is not a strong force, and isused in a supplementary capacity. In order to provide a stable fasteningfunction, suction fastening is accomplished by a special device that isindependent of the dust collector 24. If the wiring boards 3 arerelatively large and heavy, such a holding method using suction force isunnecessary. Such a method is effective in cases where the wiring boards3 are small and light.

Before being placed on this carrying table 21, the wiring boards 3 passbeneath the recognition device, i.e., the first CCD camera 20. The firstCCD camera 20 graphically recognizes the positions of the solder balls 7on the wiring boards 3, or recognizes the first cutting position marks 4formed on the wiring boards 3 beforehand, and specifies the positions.

Since the positional relationship of the first CCD camera 20 andcarrying table 21 is fixed, accurate positioning with respect to thecutting tool is accomplished by operational processing when said wiringboards 3 are placed on the carrying table 21. Next, the accuratelyplaced wiring boards 3 are fastened in place by the restraining member22 which is waiting above. This restraining member 22 has a constructionsimilar to that of the carrying table 21 to which the wiring boards 3are fastened, and clamps said wiring boards 3 between said restrainingmember 22 and the carrying table 21.

Specifically, the restraining member 22 is lowered toward the wiringboard 3 that is placed on the carrying table 21, so that the wiringboard 3 is clamped between the restraining member 22 and the carryingtable 21. A cutting groove 22 a is also formed in this restrainingmember 22 as in the aforementioned carrying table 21, so that a cuttingtool can pass through. A projecting part 22 b is disposed on theundersurface of this restraining member 22. This projecting part 22 bprevents charging or the passage of electric current, and is made ofrubber, a synthetic resin that possesses elasticity, or the like. Thisprojecting part 22 b is fastened to the lower part of the restrainingmember 22 by a method such as bonding or the like.

As a result of this projecting part 22 b, warping of the wiring boards 3at the time of fastening is prevented; furthermore, the scattering ofdust-form cutting debris into the surrounding areas is also prevented.

b. First Cutting Device 23 and Dust Collector 24

The first cutting device 23 will be described mainly with reference toFIGS. 10, 11, 13 and 14, with reference also being made to FIGS. 4 and5. After a wiring board 3 has been clamped and fastened in place by therestraining member 22, [this wiring board 3] is cut by the first cuttingdevice 23. This first cutting device 23 will be described with referenceto FIG. 10. The base 60 of the first cutting device 23 is fastened tothe end part of the first conveying device 41. A guide is formed on theupper part of this base 60 so that the saddle 61 of the first cuttingdevice 23 straddles [this guide] and is guided in a manner that allowssaid saddle to advance and retract in the vertical direction (Y)

A guide part (not shown in the figures) is also disposed on the sidesurface of this saddle 61, and a head part 62 straddles this guide partand is guided so that said head part 62 can advance and retract in thefeeding direction (X). Accordingly, the head 62 in the presentembodiment can move in two axial directions, i.e., along the X axis andY axis. The wiring boards 3 are fed one row at a time parallel to thedirection of the Z axis. After the first cutting positions marks 4 havebeen recognized by the first CCD camera 20 so that the position of eachwiring board 3 has been specified, and said wiring board 3 has beenfastened to the carrying table 21, the wiring board 3 is cut by themovement of the head 62 in the directions of the X axis and Y axis.

Furthermore, the guidance of this head 62 in the direction of the X axisis accomplished by means of a linear bearing (not shown in the figures).The same is true of the guidance of the saddle 61 in the direction ofthe Y axis relative to the base 60. By using linear bearings, it ispossible to achieve smooth guidance of the operation with a light load.In the present embodiment, two axial directions are used, i.e., thedirections of the X axis and Y axis; however, a structure in whichmovement is possible in three axial directions, i.e., along the X axis,Y axis and Z axis, may also be used. Furthermore, the driving bodiesused for these guidance operations are not shown in the figures;however, these driving bodies are servo motors or the like, and guideddriving is accomplished via ball screws.

A rotary cutting grindstone 63 is built into the abovementioned head 62so that this grindstone 63 is free to rotate. This rotary cuttinggrindstone 63 is ordinarily a disk-form diamond grindstone, and issupported on a spindle 62 a. This spindle 62 a is supported on the head62, and is rotated at a high speed. In the present embodiment, theexternal shape of the head 62 is an angular shape.

Ventilation holes 62 b that pass through the head 62 are disposed in thefour corners of the head 62. This construction is arranged so that dustgenerated during cutting can be sucked in via these ventilation holes 62b. The dust that has thus been sucked in is recovered in the dustcollector 24. The external shape of the abovementioned head 62 is anangular shape; however, in cases where this head is formed with acylindrical shape, the parts corresponding to the ventilation holes 62 bmay be formed as pipes. In cases where such pipes are used, these pipesmay be supported by installing an angular partition cover on the frontpart of the head 62. If this is done, the same effect as that obtainedin a case where the head 62 is formed with an angular shape can beobtained. The use of an angular shape makes it possible to obtain aconstruction that is easy to cool; furthermore, other devices can alsobe attached to this head 62.

Furthermore, the rotary cutting grindstone 63 is bolt-fastened to thespindle 62 a via a flange 64 by means of a bolt 65. Moreover, a toolcover 66 is installed on the head 62 so that this tool cover 66 coversthe cutting range around the cutting tool (see FIG. 13). The dust thatis enclosed inside this tool cover 66 is recovered in the dust collector24 via the ventilation holes 62 b.

Furthermore, as a result of the rotary cutting grindstone 63 beingcaused to rotate with the blade of the rotary cutting grindstone 63facing downward, the cutting operation is devised so that the cuttingdebris is conducted downward, with no cutting debris allowed to escapeupward. Furthermore, there is a danger that cutting debris will bepulled upward when the tool is retracted upward; accordingly, in orderto avoid this, the tool is smoothly retracted in the cutting state.However, if conditions are suitable so that the tool can be retractedafter being freed in the upward direction, such an operation results ina shorter retraction time.

As is shown in FIG. 13, a connecting box 68 is attached to the rear endof the head 62, and a motor 68 is attached to this connecting box 67(see FIG. 10). A belt, coupling or the like which constitutes the meansof connection with the motor 68 is contained inside the connecting box67. Furthermore, if cooling fins 69 are disposed on the exterior of thehead 62, this is effective in cooling the head 62. Moreover, a similareffect can be obtained by forming the ventilation holes 62 b with finshapes, so that these ventilation holes have a star shape 69 a (see FIG.14).

c. Second Conveying Devices That Perform Conveying, Positioning andFastening

These devices will be described mainly with reference to FIG. 8, withreference also being made to FIGS. 4 and 5. The cut wiring boards 3 athat have been cut by the first cutting device 23 are released from thefastened state and transferred to the second conveying devices 42 and43. These second conveying devices 42 and 43 also have basically thesame construction as the first conveying device 41. The cut wiringboards 3 a are long, slender strip-form parts in which IC packages arearranged in rows.

The conveying to the second cutting device 33 is performed with the cutwiring boards 3 a vacuum-chucked by a robot 42 a. The operation of thisrobot 42 a is biaxial in the vertical direction and feeding direction.The cut wiring boards 3 a are chucked and lifted upward, and aretransferred to the carrying table 31 of the second cutting device 33.

In the present embodiment, two cut wiring boards 3 a are placed on thecarrying table 31 from the second conveying device 43. Prior to beingplaced, the cut wiring boards 3 a pass the second CCD camera 30 whichconstitutes the second recognition device, so that the cutting positionsare recognized. This recognition method is similar to that describedabove; the second cutting position marks 5 are recognized, andoperational processing is performed so that the accurate cuttingpositions are specified.

The method used to accomplish fastening in the accurate positions is thesame as the method used for clamping on the carrying table 21 by therestraining member 22. However, the orientation of the carrying table 31is changed by 90 degrees relative to the orientation of the carryingtable 21. When the two cut wiring boards 3 a are inserted into thecarrying table 31 along the direction of length of the strip-form cutwiring boards 3 a, and are positioned, a restraining member 32 advancesand clamps the cut wiring boards 3 a.

The part located in front of this carrying table 31 forms a temporarycarrying table 31 a. The reason for this is that since the carryingtable 31 is a long, slender device with a narrow width, the cut wiringboards 3 a cannot be carried by the carrying table 31 alone in caseswhere these cut wiring boards 3 a are large. Accordingly, [thistemporary carrying table 31 a] is provided in order to support the cutwiring boards 3 a. As in the case of the carrying table 21, one end of ahose 34 a used for dust suction is fastened to the lower part of thecarrying table 31, and the cutting debris that is generated duringcutting is recovered by a dust collector 34 via the hose 34 a.

This dust collector 34 is identical to the dust collector 24 whichrecovers the cutting debris generated by the first cutting device 23;both of these dust collectors recover the cutting debris that isgenerated during the two cutting operations. Since small holes 21 b (31b) are formed in the carrying table 21 [(31)], the cut wiring boards 3 aare held on the carrying table 31 by a suction force in the same manneras described above.

d. Second Cutting Device 33

The second cutting device 33 will be described mainly with reference toFIG. 12, with reference also being made to FIGS. 4 and 5. When the cutwiring boards 3 a are fastened to the carrying table 31 by therestraining member 32, the two inserted cut wiring boards 3 a aresimultaneously cut by the second cutting device 33. This second cuttingdevice 33 is disposed so that the orientation of said second cuttingdevice 33 differs by 90 degrees from the orientation of the firstcutting device 23; however, the basic construction of the second cuttingdevice 33 is identical to that of the first cutting device 23.

During cutting, the rotary cutting grindstone 63 cuts the cut wiringboards 3 a while passing through the aforementioned cutting grooves 21a, 32 a along the length of said grooves. When cutting is completed, thehead 62 is retracted upward and returns to its original position. Whenthe fastening of the cut wiring boards 3 a is released by therestraining member 32, the cut wiring boards 3 a are pushed out in theforward direction by the second conveying device 43. In the presentembodiment, a method has been described in which the cut wiring boards 3a are positioned in the direction of the plane and cut; however, the cutwiring boards 3 a may also be positioned in the vertical direction, andmoved and cut in the vertical direction.

Cutting is thus repeated so that the cut wiring boards 3 a areseparated, and are finally cut as wiring boards 3 b which constitute theoriginal forms of the IC packages. When cutting is performed by thissecond cutting device 33 as well, the cutting is repeated in the samemanner as in the case of the first cutting device 23, and cutting isperformed with the two cutting devices operating simultaneously. As aresult of the two cutting devices thus operating simultaneously, themanufacturing time involved in cutting can be greatly reduced.

e. Cleaning Device 70

The cleaning device 70 will be described mainly with reference to FIGS.15, 16 and 17, with reference also being made to FIGS. 4 and 5. Tooutline the cleaning device 70, this device is constructed from a brush71, a dust-collecting hose 72, a scraper 73 and a cover 74. The brush 71has a cylindrical shape, with fine bristles arranged in the radialdirection. Since the object of cleaning consists of wire boards 3 b,thebrush 71 is made of a soft material; the wiring boards 3 b are brushedby the rotation of the brush 71 so that dust adhering to the wiringboards 3 b is removed.

The scraper 73 is a comb-form (fork-form) part, and contacts theaforementioned brush 71 via a ground wire, so that any charge on thebrush 71 caused by static electricity is removed. A cover 74 is providedwhich covers this brush 71 and scraper 73, and the aforementioneddust-collecting hose 72 is attached to one end of this cover 74. Thisdust-collecting hose 72 is used to recover dust in the dust collector 34following cleaning.

The cleaning device 70 shown in FIG. 16 has a construction in which twobrushes 71 of such a construction are installed as a set with saidbrushes 71 facing each other. This cleaning device 70 is not absolutelynecessary. If dust or the like is completely removed in the cuttingprocess so that there is no danger that such dust or the like willadhere to the wiring boards 3, this step may be omitted.

In combination with the cleaning device 70, clamping members 75 areprovided which are used to clamp the wiring boards 3 b cut by the secondcutting device 33. These clamping members are rod-form members, and twoclamping members 75 are disposed facing each other so that theseclamping members 75 can advance and retract in synchronization with eachother. The clamping members 75 rotate while acting in conjunction. Thetip end portions of these clamping members 75 have flat shapes 76, andclaw parts which are V-shaped grooves are further formed in the tip endsof these flat shapes 76. These two mutually facing claw parts are causedto advance and retract in synchronization with each other by a pair ofcylinders.

The wiring boards 3 b that are cut and conveyed have a substantiallyrectangular shape. The claw parts of the clamping members 75 arearranged so that these claw parts face each other and clamp the endparts of the substantially rectangular wiring boards 3 b.These wiringboards 3 b are clamped one at a time by the claw parts of the clampingmembers 75. With the wiring boards 3 b in a clamped state, theseclamping members 75 are passed between the two facing brushes 71. Inthis case, the top surface and undersurface of each wiring board 3 b aresimultaneously brushed. In this brushing step, both facing clampingmembers 75 are caused to undergo a half-rotation of 180 degrees, so thatthe orientation of the top surface and undersurface of each wiring board3 b is reversed.

As a result, the surface on which the solder balls 7 are disposed iscaused to face downward. As a result of the wiring boards 3 b thus beinginverted during the conveying process, time is saved compared to a casein which the products placed in a fixed position are subsequentlyinverted as in conventional methods. Furthermore, the above process wasdescribed in terms of a single unit wiring board 3 b; however, it goeswithout saying that the processing time can be shortened if a pluralityof wiring boards 3 b are processed using the same mechanism.

[Product Accommodating Box 81]

This is a device which accommodates the wiring boards 3 b for which theaforementioned cleaning has been completed as IC package products.Although this is not shown in the figures, the clamping of the wiringboards 3 b by the clamping members 75 is released, and the wiring boards3 b are accommodated in the product accommodating box 81 in an orderlyfashion by an accommodating conveying device 80. This conveying isaccomplished by a three-dimensional operation performed by the robot ofthe accommodating conveying device 80. A plurality of productaccommodating boxes 81 are prepared, and when one accommodating box isfilled, this box is conveyed to the outside; the next productaccommodating box is then placed in a specified position, and the samework is continued.

The present invention is constructed as described above; next, theoperation of the present invention will be described. A wiring board 3which has been conveyed with the surfaces on which the solder balls 7are disposed facing upward is placed on the carrying table 21 after thefirst cutting position marks 4 which indicate the cutting position havebeen recognized by the first CCD camera 20. Next, the restraining member22 which is waiting above is lowered so that the wiring board 3 isfastened in place. This fastening is accomplished by the projecting parton the lower part of the restraining member 22.

After this fastening is completed, the first cutting device 23 passesthrough the cutting grooves in the carrying table 21 and restrainingmember, and cuts the wiring board 3, so that long, slender strip-formcut wiring boards 3 a are cut out. Without any change in orientation,the cut wiring boards 3 a that have been cut out are positioned on thecarrying table 31 of the second cutting device 33 after the secondcutting position marks 5 have been recognized by the second CCD camera30. Then, the restraining member 32 is lowered so that the cut wiringboards 3 a are fastened in place. Following this fastening, the cutwiring boards 3 a are cut by the second cutting device 33. This cuttingis performed simultaneously on two strips that are sent together. Thecut wiring boards 3 b are clamped by the rod-form clamping members 75and caused to pass through the cleaning device. The wiring boards 3 bare turned upside down in this conveying step. Then, the wiring boards 3b that have been cleaned and had the surfaces on which the solder balls7 are disposed turned to face downward are accommodated in the productaccommodating box as the [final] products.

[Other Embodiments]

[Rotary Cutting Grindstone 63]

In the cutting devices of the abovementioned embodiment, the rotarycutting grindstones 63 were described as disk-form diamond tools.However, CBN (cubic boron nitride) grindstones may also be used; suchgrindstones are widely used as cutting grindstones. Since such CBNgrindstones are universally known, a description of properties and thelike will be omitted here. Such CBN grindstones or borazone grindstonesare effective in the following respects.

Specifically, in the wiring boards 3 that are the object of cutting,whose material may be referred to as a resin, hard compounds such assilicon oxide or the like are admixed in a thermosetting synthetic resinsuch as an epoxy resin or the like. Furthermore, a relatively soft metalsuch as copper or the like is used as the wiring material. In caseswhere such materials are cut with a diamond tool, the resin portions arereadily cut so there is no problem in this regard.

However, when the aforementioned soft metal portions are cut, the tipend portions of the diamond blade form an obtuse angle, and sincecutting is performed by high-speed rotation, the blade is burned by theextreme heat so that blade becomes rounded. As a result, the cuttingresistance increases, and since soft metals such as copper or the likehave a low melting point, there is danger that such soft metals willfuse to the abrasive grains of the diamond grindstone so that cuttingbecomes impossible.

Borazone grindstones have a lower hardness than diamond grindstones; [inthe case of borazone grindstones, ] however, when the limit to grinding(cutting) state is reached, some of the abrasive grains undergoself-destruction and are separated, so that these abrasive grains arereplaced by fresh abrasive grains. Accordingly, the blade is constantlymetabolized so that the grinding properties are maintained. Suchseparation of the abrasive grains occurs under appropriate conditions sothat there is no wearing away of the grindstone.

As a result, if the wiring boards 3 meet these conditions, a constantcutting state can be maintained, so that clogging by soft metals can bereduced, thus improving the quality [of the product] Considering theadvantages of diamond grindstones and borazone grindstones, constructionas a composite grindstone is also possible. FIG. 18 shows an example ofa composite grindstone. In this figure, FIG. 18 (b) is a partialenlarged view of FIG. 18 (a), and FIG. 18 (c) is a partial enlarged viewof FIG. 18 (b).

This grindstone has a construction in which cut-outs (valley parts) 63 aare formed in the manner of a gear in portions of the blade of a rotarycutting grindstone 63. Diamond abrasive grains 63 c and CBN abrasivegrains 63 d are electro-deposited by electroplating on the peak parts 63b of this blade. The proportions of the diamond abrasive grains 63 c andCBN abrasive grains, and the sizes of the respective abrasive grains 63d, are determined by experience.

In the present embodiment, the proportion of CBN abrasive grains 63 dwas set in the range of 30 to 70%, and the size of the CBN abrasivegrains was set at 1 to 2 times the size of the diamond abrasive grains;furthermore, the concentration (disperse density) of the abrasive grainswas lowered. As a result, the aforementioned problems were eliminated.Especially in the cutting of soft metals, copper or the like that wasfused to the abrasive grains 63 c during cutting was pushed from thepeak parts 63 b of the grindstone into the cut-out parts (valley parts)63 a as cutting progressed, and this metal was separated from thegrindstone when said metal reached the valley areas.

In order to heighten this effect, it is desirable that the peak parts 63b be as narrow as possible within the range permitted by strengthconsiderations. When the thickness of the rotary cutting grindstone 63is large, cutting tends to be accompanied by the generation of heat. Onthe other hand, when this thickness is small, limits are generated byconsiderations of strength, and cracking tends to occur. This thicknessshould be set at the optimal value in accordance with the conditions ofthe wiring boards that are to be cut.

[Merits of the Invention]

In the present invention, as was described above in detail, a series ofcutting operations in which cutting is simultaneously performed by twocutting devices are concentrated in a single apparatus, and peripheraldevices are attached so that a compact structure is obtained.Accordingly, economical and highly efficient manufacturing is possible.

Furthermore, the conventional step of bonding to a film or the like andworking in this state is made unnecessary. As a result, a greatreduction in the amount of work required for manufacture is achieved.Moreover, since cleaning by means of water is not performed, the need totreat cleaning water containing copper or the like in consideration ofthe environment is eliminated.

Furthermore, the cutting tools used are tools that tend not to becomeclogged; accordingly, a long-term stable cutting operation is possible,and products with a uniform quality can be manufactured.

What is claimed is:
 1. An apparatus for manufacturing electronic partscomprising: a conveying body which is used to convey a plate-formelectronic parts; a first fastening device which positions and fastensplate-form electronic parts sealed in resin that are conveyed by saidconveying body; a first cutting device which moves said plate-formelectronic parts that have been positioned and fastened in place by saidfirst fastening device in one direction on the plane that includes saidplate-form electronic parts, and cuts said plate-form electronic parts;a second fastening device which conveys, positions and fastensrectangular-form electronic parts that have been cut by said firstcutting device; a second cutting device which moves saidrectangular-form electronic parts that have been conveyed, positionedand fastened in place by said second fastening device in a directionthat crosses the abovementioned cutting direction, and which cuts saidrectangular-form electronic parts; and a product accommodating devicewhich accommodates the single electronic parts that have been cut bysaid second cutting device.
 2. The apparatus for manufacturingelectronic parts according to claim 1, wherein said first fasteningdevice and said second fastening device contain a position recognitiondevice which optically recognizes the positions of said plate-formelectronic parts or said rectangular-form electronic parts that havebeen conveyed.
 3. The apparatus for manufacturing electronic partsaccording to claim 2, wherein the device that optically recognizes thepositions of said plate-form electronic parts or said rectangular-formelectronic parts is a device which recognizes the shapes of saidplate-form electronic parts or said rectangular-form electronic parts bymeans of a CCD camera, and specifies the cutting positions.
 4. Theapparatus for manufacturing electronic parts according to claim 1,wherein said first fastening device and said second fastening device aredevices that fasten said conveyed plate-form electronic parts or saidrectangular-form electronic parts by means of restraining members thatapply pressure from above after the electronic parts have been placed ona carrying table.
 5. The apparatus for manufacturing electronic partsaccording to claim 4, wherein said first pressure-applying fasteningdevice and said second fastening device are additionally provided withmeans for fastening said rectangular-form electronic parts or saidrectangular-form electronic parts by means of a vacuum suction force. 6.The apparatus for manufacturing electronic parts according to claim 4,wherein in said first pressure-applying fastening device and said secondfastening device, projecting parts which are used to press saidplate-form electronic parts or said rectangular-form electronic partsare disposed on said restraining members.
 7. The apparatus formanufacturing electronic parts according to claim 4, wherein therestraining members which fasten said plate-form electronic parts orsaid rectangular-form electronic parts after said electronic parts havebeen placed on a carrying table have cutting grooves formed in saidcarrying table and said restraining members, which are used to allow thepassage of a rotary tool in order to cut said plate form electronicparts and said rectanglar-form electronic parts.
 8. The apparatus formanufacturing electronic parts according to claim 1, wherein said firstcutting device and said second cutting device are equipped with dustcollectors that use suction to capture the dust-form cutting debris thatis generated by cutting.
 9. The apparatus for manufacturing electronicparts according to claim 1, wherein said first cutting device and saidsecond cutting device are devices which have rotary cutting tools, andwhich perform advancing and retracting movements on two or more axes.10. The apparatus for manufacturing electronic parts according to claim9, wherein said rotary cutting tools are tools that are formed ascomposite tools by the electrodeposition of diamond abrasive grains andCBN abrasive grains.
 11. The apparatus for manufacturing electronicparts according to claim 1, wherein said product accommodating device isa device which clamps the single electronic parts cut by said secondcutting device, inverts said electronic parts and alters the orientationof said electronic parts.
 12. The apparatus for manufacturing electronicparts according to claim 1, wherein said product accommodating device isa device which brushes clamped said single electronic parts.